Amkor Technology, Inc.

Amkor Technology, Inc. provides outsourced semiconductor packaging and test services globally. Their offerings include turnkey packaging and test services, flip chip-scale package products, wafer-level CSP packages, lead frame packages, MEMS packages, and advanced system-in-package modules. The company serves integrated device manufacturers, fabless semiconductor companies, original equipment manufacturers, and contract foundries. Amkor Technology generates revenue by providing semiconductor wafer bump, wafer probe, wafer back-grind, package design, packaging, and test services, catering to the needs of various industries such as smartphones, tablets, networking, storage, computing, and consumer electronics.

Products

• Semiconductor packaging and test services

• Flip chip-scale package products

• Wafer-level CSP packages

• Lead frame packages

• MEMS packages

• Advanced system-in-package modules